Semiconductor Physics, Quantum Electronics & Optoelectronics. 2005. V. 8, N 1. P. 053-059.
Effect of internal electrical field on compositional dependence of p-n
junction depth in ion milled p-CdxHg1–xTe
1R&D Institute for Materials SRC "Carat", 202 Stryjska Str., 79031 Lviv, Ukraine
Abstract. The dependence of the conversion depth in CdxHg1–xTe alloys subjected to
ion-beam milling (CMT) on alloy composition and treatment temperature is studied both
experimentally and theoretically. It is shown that in compositionally homogeneous
crystals the dependence is defined by internal electric fields, which affect the diffusion of
charged intrinsic defects that arise as a result of the treatment. The results of calculations
of the effect of the potentials of the p-n junction formed by ion-milling on the conversion
depth fit well both the original experimental data and those taken from the literature. The
data obtained confirm the validity of the diffusion model of the formation of the
excessive mercury source in CMT subjected to ion-beam milling, which was proposed by
the authors earlier. The results gained allow one to precisely predict and control the
conversion depth in CMT crystals and epitaxial layers subjected to ion milling for p-n
junction fabrication. This makes the results presented in the paper useful in CMT infrared
detector technology.
Keywords: CdxHg1–xTe, ion-beam milling, conductivity type conversion.
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