Semiconductor Physics, Quantum Electronics & Optoelectronics. 2015. V. 18, N 2. P. 117-122.
https://doi.org/10.15407/spqeo18.02.117


                                                                 

References

1.S.C. Jain, M. Willander, J. Narayan and R. Van Overstraeten, III-nitrides: Growth, characterization, and properties. J. Appl. Phys. 87(3), p. 965-1006 (2000).
https://doi.org/10.1063/1.371971
 
2. S. Strite and H. Morkoç, GaN, AlN, and InN: A review. J. Vac. Sci. Technol. B, 10(4), p. 1237-1266 (1992).
https://doi.org/10.1116/1.585897
 
3. S.N. Mohammad, H. Morkoç, Progress and prospects of group-III nitride semiconductors. Progress in Quantum Electronics, 20(5-6), p. 361-525 (1996).
https://doi.org/10.1016/S0079-6727(96)00002-X
 
4. K. Kubota, Y. Kobayashi and K. Fujimoto, Preparation and properties of III-V nitride thin films. J. Appl. Phys. 66(7), p. 2984-2988 (1989).
https://doi.org/10.1063/1.344181
 
5. K.S.A. Butcher and T.L. Tansley, Ultrahigh resistivity aluminum nitride grown on mercury cadmium telluride. J. Appl. Phys. 90(12), p. 6217-6221 (2001).
https://doi.org/10.1063/1.1415532
 
6. D.D.L. Chung, Materials for thermal conduction. Appl. Therm. Eng. 21(16), p. 1593-1605 (2001).
https://doi.org/10.1016/S1359-4311(01)00042-4
 
7. I. Yonenaga, Thermo-mechanical stability of wide-bandgap semiconductors: high temperature hard-ness of SiC, AlN, GaN, ZnO and ZnSe. Physica B: Condens. Matt. 308–310, p. 1150-1152 (2001).
https://doi.org/10.1016/S0921-4526(01)00922-X
 
8. I. Ivanov, L. Hultman, K. Järrendahl, et al., Growth of epitaxial AlN(0001) on Si(111) by reactive magnetron sputter deposition. J. Appl. Phys. 78(9), p. 5721-5726 (1995).
https://doi.org/10.1063/1.359632
 
9. C.T.M. Ribeiro, F. Alvarez and A.R. Zanatta, Structural properties of aluminum-nitrogen films prepared at low temperature. Appl. Phys. Lett. 81(6), p. 1005-1007 (2002).
https://doi.org/10.1063/1.1498002
 
10. D. Manova, P. Huber, S. Mändl, B. Rauschenbach, Filtered arc deposition and implantation of aluminium nitride. Surface and Coatings Technology, 142–144, p. 61-66 (2001).
https://doi.org/10.1016/S0257-8972(01)01075-1
 
11. Y.F. Lu, Z.M. Ren, T.C. Chong, B.A. Cheong, S.K. Chow and J.P. Wang, Ion-assisted pulsed laser deposition of aluminum nitride thin films. J. Appl. Phys. 87(3), p. 1540-1542 (2000).
https://doi.org/10.1063/1.372046
 
12. Y. Watanabe and Y. Nakamura, Influence of ion beam irradiation on crystallographic structure and surface morphology of aluminium nitride thin films. Ceram. Intern. 24(6), p. 427-432 (1998).
https://doi.org/10.1016/S0272-8842(97)00031-X
 
13. J.-W. Soh, S.-S. Jang, I.-S. Jeong, W.-J. Lee, C-axis orientation of AlN films prepared by ECR PECVD. Thin Solid Films, 279(1-2), p. 17-22 (1996).
https://doi.org/10.1016/0040-6090(95)08027-9
 
14. R.Y. Krupitskaya and G.W. Auner, Optical characterization of AlN films grown by plasma source molecular beam epitaxy. J. Appl. Phys. 84(5), p. 2861-2865 (1998).
https://doi.org/10.1063/1.368428
 
15. V.F. Semenuk, E.M. Rudenko, I.V. Korotash et al., Unified technological ion-plasma facility for formation of nanostructures. Metallofizika i Noveishie Tekhnologii, 33(2), p. 223-231 (2011), in Russian.
 
16. C.A. Chang, Enhanced Cu-Teflon adhesion by presputtering treatment: Effect of surface morphology changes. Appl. Phys. Lett. 51(16), p. 1236-1238 (1987).
https://doi.org/10.1063/1.98741
 
17. T.S. Moss, G.J. Burrell, B. Ellis, Semiconductor Opto-electronics. Mir, Moscow, 1976 (in Russian).
 
18. N.S. Zayats, V.G. Boiko, P.A. Gentsar, O.S. Litvin, V.P. Papusha, N.V. Sopinskii, Optical study of AlN-n-Si(100) films obtained by RF magnetron sputtering technique. Fizika i Tekhnika Polupro-vodnikov, 42(2), p. 195-198 (2008), in Russian.