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Semiconductor Physics, Quantum Electronics & Optoelectronics. 2011. V. 14, N 4. P. 478-481.
Modelling the temperature conditions in three-dimensional piecewise
homogeneous elements for microelectronic devices
National University “Lviv Polytechnic”, 28-a, S. Bandery str., 79013 Lviv, Ukraine
E-mail: ikni.pz@gmail.com
Abstract.
The steady-state linear thermal conductivity problem for an isotropic layer
with a thin foreign parallelepipedic inclusion that releases heat has been considered with
account of heat dissipation. The methodology for analytic solution of three-dimensional
steady-state boundary thermal conductivity problem has been suggested.
Keywords: temperature, thermal conductivity, steady-state, isotropic, heat dissipation,
ideal thermal contact, foreign inclusion.
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