Semiconductor Physics, Quantum Electronics & Optoelectronics. 2011. V. 14, N 4. P. 478-481.

Modelling the temperature conditions in three-dimensional piecewise homogeneous elements for microelectronic devices
V.I. Gavrysh

National University “Lviv Polytechnic”, 28-a, S. Bandery str., 79013 Lviv, Ukraine E-mail:

Abstract. The steady-state linear thermal conductivity problem for an isotropic layer with a thin foreign parallelepipedic inclusion that releases heat has been considered with account of heat dissipation. The methodology for analytic solution of three-dimensional steady-state boundary thermal conductivity problem has been suggested.

Keywords: temperature, thermal conductivity, steady-state, isotropic, heat dissipation, ideal thermal contact, foreign inclusion.

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